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A New Prewetting Process of Through Silicon Vias (TSV) Electroplating for 3D Integration 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2019, 卷号: 28, 期号: 3
作者:  Li, Cao;  Nie, Jun;  Zou, Jinglong;  Liu, Sheng;  Zheng, Huai
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/05
A new prewetting process of through silicon vias (TSV) electroplating for 3D integration 期刊论文
Journal of Microelectromechanical Systems, 2019, 卷号: 28, 期号: 3
作者:  Li, Cao;  Nie, Jun;  Zou, Jinglong;  Liu, Sheng;  Zheng, Huai
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/05
Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3006-D3012
作者:  Zhu, QS;  Zhang, X;  Liu, CZ;  Liu, HY
收藏  |  浏览/下载：18/0  |  提交时间：2018/12/25
Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3006-D3012
作者:  Zhu, Q. S.;  Zhang, X.;  Liu, C. Z.;  Liu, H. Y.
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02
Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor 期刊论文
MICROMACHINES, 2018, 卷号: 9
作者:  Li, Haiwang;  Liu, Jiasi;  Xu, Tiantong;  Xia, Jingchao;  Tan, Xiao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/30
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer 其他
2016-01-01
Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Meng, Wei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
IEEE Electronic Components and Technology Conference（ECTC）, 美国
作者:  Guoping Zhang;  Kun Jiang;  Qiang Liu;  Jinhui Li;  Rong Sun
收藏  |  浏览/下载：15/0  |  提交时间：2016/01/27
Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection 其他
2012-01-01
Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16

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