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浏览/检索结果: 共4条，第1-4条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11 作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan 收藏  |  浏览/下载：16/0  |  提交时间：2022/01/27 Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8 作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun 收藏  |  浏览/下载：133/0  |  提交时间：2021/02/02 SnBi solder  Ag and In addition  microhardness  nano-indentation  impact toughness  fracture mechanism   High Thermoelectric Performance of Co-Doped P-Type Polycrystalline SnSe via Optimizing Electrical Transport Properties 期刊论文 ACS APPLIED MATERIALS & INTERFACES, 2020, 卷号: 12, 期号: 7, 页码: 8446-8455 作者:  Li, Chengjun;  Wu, Hong;  Zhang, Bin;  Zhu, Huaxing;  Fan, Yijing 收藏  |  浏览/下载：14/0  |  提交时间：2020/08/24 SnSe  codoping  thermoelectric performance  Sn/Ag-rich particles  conversion afficiency   Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020 作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun 收藏  |  浏览/下载：3/0  |  提交时间：2020/12/16 TENSILE  JOINTS  SILVER  CU