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CORC

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Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484
作者:  Zhang, Huajin;  Hu, Xiaowu;  Liu, Yi;  Zhang, Jiankang;  Jiang, Xiongxin
收藏  |  浏览/下载：28/0  |  提交时间：2022/03/01
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：16/0  |  提交时间：2022/01/27
Progress in Functional Research of Amorphous Alloys 期刊论文
Xiyou Jinshu/Chinese Journal of Rare Metals, 2021, 卷号: 45, 期号: 8, 页码: 998-1009
作者:  Tian, Lin;  Li, Chunyan;  Zhai, Jianshu;  Lu, Yu;  Kou, Shengzhong
收藏  |  浏览/下载：28/0  |  提交时间：2022/02/17
Amorphous alloys  Asphalt pavements  Atoms  Biological water treatment  Biomimetics  Casting  Catalyst activity  Cobalt alloys  Corrosion resistance  Corrosion resistant alloys  Crystal atomic structure  Crystals  Electrodes  Electronics industry  Fuel cells  Functional materials  Grain boundaries  Hardness  Heat conduction  Hydrogen storage  Hydrogen storage alloys  Industrial emissions  Industrial research  Industrial water treatment  Ion beams  Magnetism  Marine communication  Metallic glass  Nanocrystalline materials  Phase composition  Porous materials  Satellite antennas  Shape-memory alloy  Silicon steel  Sputtering  Strontium alloys  Structural properties  Sustainable development  Temperature  Wastewater treatment  Wear resistance  Amorphous alloy catalyst  Co-based amorphous alloys  Comprehensive performance  Comprehensive properties  Development of science and technologies  Electronic manufacturing  Liquid phase compositions  Low temperature performance  
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载：133/0  |  提交时间：2021/02/02
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载：3/0  |  提交时间：2020/12/16
TENSILE  JOINTS  SILVER  CU  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ
收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05
Composition design of Sn-rich Sn-Au-Ag solders using cluster-plus-glue-atom model 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 11192-11201
作者:  Huang, M. L.;  Huang, F. F.;  Yang, Y. C.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 卷号: 664, 页码: 221-226
作者:  Huang, M. L.;  Yang, Y. C.;  Chen, Y.;  Dong, C.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Thermodynamic assessment of phase equilibria in the Sn-Au-Bi system with key experimental verification 期刊论文
http://dx.doi.org/10.1557/JMR.2010.0056, 2010
Gao, F.; Wang, C. P.; Liu, X. J.; Takaku, Y.; Ohnuma, I.; Ishida, K.; 刘兴军
收藏  |  浏览/下载：3/0  |  提交时间：2013/12/12
Thermodynamic assessment of phase equilibria in the Sn-Au-Bi system with key experimental verification 期刊论文
http://dx.doi.org/10.1557/JMR.2010.0056, 2010
Gao, F.; Wang, C. P.; Liu, X. J.; Takaku, Y.; Ohnuma, I.; Ishida, K.; 王翠萍
收藏  |  浏览/下载：2/0  |  提交时间：2013/12/12

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