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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing 期刊论文 TRIBOLOGY INTERNATIONAL, 2019, 卷号: 138, 页码: 307-315 作者:  Wang, Lin;  Zhou, Ping;  Yan, Ying;  Kang, Renke;  Guo, Dongming 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02 CMP  Pad asperity  Material removal rate  Chemical-mechanical synergy   CHEMICAL MECHANICAL MATERIAL REMOVAL OF SILICON DIOXIDE BY A SINGLE PAD ASPERITY 会议论文 2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2019-01-01 作者:  Yang, Shuo;  Wang, Lin;  Zhou, Ping;  Yan, Ying;  Jin, Zhuji 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02 Chemical-mechanical wear of monocrystalline silicon by a single pad asperity 期刊论文 INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2017, 卷号: 120, 页码: 61-71 作者:  Wang, Lin;  Zhou, Ping;  Yan, Ying;  Zhang, Bi;  Kang, Renke 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02 Chemical-mechanical polishing  Pad asperity  Removal mechanism  Chemical bonds   Analysis on contact and flow features in CMP process 期刊论文 2010, 2010 Zhang Chaohui; Luo Jianbin; Liu Jinquan; Du Yongping 收藏  |  浏览/下载：2/0 Nano particles' behavior in non-Newtonian slurry in mechanical process of CMP 期刊论文 2010, 2010 Haosheng, C.; Jiang, L.; Darong, C.; Jiadao, W. 收藏  |  浏览/下载：2/0