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Light Extraction Efficiency Optimization of AlGaN-Based Deep-Ultraviolet Light-Emitting Diodes 期刊论文
Ecs Journal of Solid State Science and Technology, 2020, 卷号: 9, 期号: 4, 页码: 5
作者:  H. Wan,S. J. Zhou,S. Y. Lan and C. Q. Gui
收藏  |  浏览/下载：6/0  |  提交时间：2021/07/06
Electromigration-induced -Sn grain rotation in lead-free flip chip solder bumps 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Kuang, Jiameng M.;  Sun, Hongyu Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
High-Performance Green Flip-Chip LEDs with Double-Layer Electrode and Hybrid Reflector 期刊论文
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2019, 卷号: 8, 期号: 8
作者:  Zhao, Jie;  Liu, Xingtong;  Xu, Haohao;  Miao, Jiahao;  Hu, Jinfeng
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/05
High-Power GaN-Based Vertical Light-Emitting Diodes on 4-Inch Silicon Substrate 期刊论文
Nanomaterials, 2019, 卷号: 9, 期号: 8, 页码: 10
作者:  Q.Zhao;  J.H.Miao;  S.J.Zhou;  C.Q.Gui;  B.Tang
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24
Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall 期刊论文
Nanomaterials, 2019, 卷号: 9, 期号: 3, 页码: 8
作者:  B.Tang;  J.Miao;  Y.C.Liu;  H.Wan;  N.Li
收藏  |  浏览/下载：1/0  |  提交时间：2020/08/24
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
Integrating Silicon Photonics and Laser Dies using Flip-Chip Technology 专利
专利号: US20180011248A1, 申请日期: 2018-01-11, 公开日期: 2018-01-11
作者:  BOURSTEIN, IDO;  ROCKMAN, SYLVIE
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/31
Tailored surface chemistry of SiO2 particles with improved rheological, thermal-mechanical and adhesive properties of epoxy based composites for underfill applications 期刊论文
POLYMER, 2018
作者:  Li, Gang;  He, Yachuan;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong
收藏  |  浏览/下载：20/0  |  提交时间：2019/01/31
Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Kuang, Jiameng;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
An Analytical Model for Permeability of Underfill Flow in Flip-Chip Packaging With Consideration of the Actual Specific Surface and Tortuosity 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1507-1514
作者:  Yao, Xing Jun[1];  Zhang, Wen Jun[2]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22

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