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浏览/检索结果: 共2条，第1-2条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing 期刊论文 JOURNAL OF MANUFACTURING PROCESSES, 2019, 卷号: 44, 页码: 47-54 作者:  Pan, Bo;  Kang, Renke;  Guo, Jiang;  Fu, Haiyang;  Du, Dongxing 收藏  |  浏览/下载：42/0  |  提交时间：2019/12/02 Double-sided lapping  Chemical mechanical polishing  Flatness  Surface integrity  Residual stress   Double-sided lapping of thin copper substrate by textured fixed-abrasive pad 会议论文 19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019, Bilbao, Spain, 2019-06-03 作者:  Pan, Bo;  Kang, Renke;  Fu, Haiyang;  Zhu, Xianglong;  Guo, Jiang 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02