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CORC

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Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing (EI收录SCI收录) 期刊论文
Transactions of Nonferrous Metals Society of China (English Edition), 2014, 卷号: 24, 页码: 1619-1628
作者:  Yue, Wu[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25
Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
H. F. Zou; Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：16/0  |  提交时间：2013/02/05
Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328
Q. K. Zhang; H. F. Zou; Z. F. Zhang
收藏  |  浏览/下载：14/0  |  提交时间：2012/04/13
Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature 期刊论文
Journal of Materials Research, 2011, 卷号: 26, 期号: 3, 页码: 449-454
H. F. Zou; Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：9/0  |  提交时间：2012/04/13
Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文
Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 5, 页码: 1785-1789
T. Y. Kang; Y. Y. Xiu; C. Z. Liu; L. Hui; J. J. Wang; W. P. Tong
收藏  |  浏览/下载：11/0  |  提交时间：2012/04/13
Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者:  Kang T Y;  Xiu Y Y;  Hui L;  Wang J J;  Tong W P
收藏  |  浏览/下载：1/0  |  提交时间：2021/02/26
Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate 期刊论文
Journal of Materials Research, 2010, 卷号: 25, 期号: 2, 页码: 303-314
Q. K. Zhang; H. F. Zou; Z. F. Zhang
收藏  |  浏览/下载：26/0  |  提交时间：2012/04/13
Weakening of the Cu/Cu(3)Sn(100) Interface by Bi Impurities 期刊论文
Journal of Electronic Materials, 2010, 卷号: 39, 期号: 8, 页码: 1277-1282
X. Y. Pang; P. J. Shang; S. Q. Wang; Z. Q. Liu; J. K. Shang
收藏  |  浏览/下载：11/0  |  提交时间：2012/04/13
INTERFACIAL EFFECTS OF FATIGUE CRACKING IN METALLIC MATERIALS 期刊论文
ACTA METALLURGICA SINICA, 2009, 卷号: 45, 期号: 7, 页码: 788-800
作者:  Zhang Zhefeng;  Zhang Peng;  Tian Yanzhong;  Zhang Qingke;  Qu Shen
收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02

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