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CORC

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Integrated electrochemical analysis of polyvinylpyrrolidone(PVP) as the inhibitor for copper chemical mechanical planarization(Cu-CMP） 期刊论文
Journal of Alloys and Compounds, 2019
作者:  GuangYang;  HaixuWang;  NingWang;  RongSuna;  Ching-PingWong
收藏  |  浏览/下载：36/0  |  提交时间：2019/01/31
Environment friendly chemical mechanical polishing of copper 期刊论文
APPLIED SURFACE SCIENCE, 2019, 卷号: 467, 页码: 5-11
作者:  Zhang, Zhenyu;  Cui, Junfeng;  Zhang, Jiabo;  Liu, Dongdong;  Yu, Zhijian
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
Cu  COS  CMP  H2O2  Chelating  
Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 155, 页码: 476-482
作者:  Guo, Xiaoguang;  Wang, Xiaoli;  Jin, Zhuji;  Kang, Renke
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process 期刊论文
APPLIED SURFACE SCIENCE, 2018, 卷号: 435, 页码: 983-992
作者:  Shi, Junqin;  Chen, Juan;  Fang, Liang;  Sun, Kun;  Sun, Jiapeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/26
Influence of slurry components on copper CMP performance in alkaline slurry 期刊论文
Microelectronic Engineering, 2017
作者:  Yang F(杨飞);  Cao H(曹鹤);  Xu QZ(徐勤志);  Chen L(陈岚)
收藏  |  浏览/下载：11/0  |  提交时间：2018/04/28
Investigation of Evolution Processes of Wafer Profiles With Edge Over Erosion in Copper CMP 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2017, 卷号: 30, 期号: 1, 页码: 69-77
作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/15
Investigation of evolution processes of wafer profiles with edge over erosion in copper CMP 期刊论文
IEEE Transactions on Semiconductor Manufacturing, 2017, 卷号: 30, 期号: 1, 页码: 69-77
作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng
收藏  |  浏览/下载：15/0  |  提交时间：2020/11/14
Modeling of evolution process of edge over erosion in copper CMP using frequency components algorithm 会议论文
Shanghai, China, March 13, 2016 - March 14, 2016
作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/15
MODELING OF EVOLUTION PROCESS OF EDGE OVER EROSION IN COPPER CMP USING FREQUENCY COMPONENTS ALGORITHM 会议论文
作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/15
Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文
IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:  Wu, Lixiao;  Yan, Changfeng
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14

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