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浏览/检索结果: 共4条，第1-4条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262 作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip-scale package (CSP)  flip-chip die attach  high-power light-emitting diode (LED)  reliability  voids   Dynamic reliability approach of chip scale package assembly under vibration environment 期刊论文 MICROELECTRONICS INTERNATIONAL, 2014, 卷号: 31, 期号: 2, 页码: 71-77 作者:  Yang, Ping[1];  Tang, Xiusheng[2];  Liu, Yu[3];  Wang, Shuting[4];  Yang, Jianming[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24 Reliability  Vibration  CSP assembly  Fatigue life   16-channel 0.35 mu m CMOS/VCSEL optoelectronic devices 会议论文 asia-pacific optical and wireless communications conference (apoc 2001), beijing, peoples r china, nov 12-15, 2001 Chen HD; Mao LH; Jun T; Kun L; Yun D; Huang YZ; Wu RH; Jun F; Ke XM; Liu HY; Wang Z 收藏  |  浏览/下载：13/0  |  提交时间：2010/10/29 VCSEL  CMOS  MCM  optoelectronic integration  smart pixels  optical interconnects  SURFACE-EMITTING LASERS  VLSI   VCSEL based optoelectronic multiple chip modules 会议论文 conference on optical interconnects for telecommunication and data communications, beijing, peoples r china, nov 08-10, 2000 Chen HD; Liang K; Du Y; Huang YZ; Tiang J; Ma XY; Wu RH; Li SY; Guo WL; Xu GJ; Wang Y 收藏  |  浏览/下载：10/0  |  提交时间：2010/10/29 VCSEL  photodetector  CMOS  MCM  optoelectronic integration  optical interconnects  SURFACE-EMITTING LASERS  MQW MODULATORS  INTEGRATION  CIRCUITS  VLSI