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浏览/检索结果: 共6条，第1-6条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure 期刊论文 SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 281, 页码: 1-8 作者:  Li, Zhenhao;  Na, Shuai;  Chen, Albert I. H.;  Wong, Lawrence L. P.;  Sun, Zhendong 收藏  |  浏览/下载：31/0  |  提交时间：2018/11/16 Capacitive micromachined ultrasonic transducer  Adhesive wafer bonding  Photosensitive benzocyclobutene  Resonator   Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他 2015-01-01 Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 Low Temperature Multi-layer Wafer Level Package for Chip Scale Atomic Clock (CSAC) 其他 2015-01-01 Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 multi-layer bonding  wafer level package  anodic bonding  BCB adhesive bonding  CSAC   A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他 2012-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 Development of a Through-Stack-Via Integrated SRAM Module 其他 2012-01-01 Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16 Study on Flow Behavior of BCB in Adhesive Bonding Aiming at Reducing Transverse Deformation 其他 2012-01-01 Deng, Kangfa; Zheng, Huan; Jiang, Shaobo; Zhang, Wei 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13