CORC

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CORC

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Cellulose in situ formation of three primary nanoparticles for polymer scalable colors 期刊论文
JOURNAL OF NANOSTRUCTURE IN CHEMISTRY, 2022, 页码: 11
作者:  Zhang, Yang;  Xu, Zhiqiang;  Meng, Zhichao;  Shi, Shan;  Sui, Guoxin
收藏  |  浏览/下载：15/0  |  提交时间：2022/07/01
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：6/0  |  提交时间：2021/02/02
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Research of 3D Printing Self-support Technology Based on DFM 会议论文
9th China Academic Conference on Printing and Packaging, 2018, Jinan, China, 2018-11-16
作者:  Li, Meng;  Liu, Linlin;  Wu, Qiumin;  Liu, Xiang;  Ma, Jie
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/20
Design and Implementation of a Compact 3D Stacked RF Front-End Module for Micro Base Station 期刊论文
IEEE Transactions on Components Packaging and Manufacturing Technology, 2018
作者:  Wan LX(万里兮);  Tian GX(田更新);  Li J(李君);  Hou FZ(侯峰泽);  Zhang WW(张文雯)
收藏  |  浏览/下载：26/0  |  提交时间：2019/04/25
Core-shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction. 期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2018
作者:  Liu, Shaoqing;  Zhao, Bo;  Jiang, Li;  Zhu, Yan-Wu;  Fu, Xian-Zhu
收藏  |  浏览/下载：12/0  |  提交时间：2019/01/31
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
The 68th Electronic Components and Technology Conference
作者:  Huang ML(黄明亮);  Zou L(邹林);  Yin SQ(尹斯奇)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02

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