CORC

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CORC

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Inverse design of quantum spin hall-based phononic topological insulators 期刊论文
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2019, 卷号: 125, 页码: 550-571
作者:  Nanthakumar, S. S.;  Zhuang, Xiaoying;  Park, Harold S.;  Chuong Nguyen;  Chen, Yanyu
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhou, Q.;  Li, Q.;  Zhou, Y.;  Wang, X. J.;  Huang, M. L.
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/09
In situ study on reverse polarity effect in Cu/Sn-9Zn/Ni interconnect undergoing liquid-solid electromigration 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 卷号: 619, 页码: 667-675
作者:  Huang, M. L.;  Zhang, Z. J.;  Zhao, N.;  Yang, F.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Enhancement of gas-to-liquid oxygen transfer in the presence of fine solid particles for air-exposed multiphase system 期刊论文
CHEMICAL ENGINEERING RESEARCH & DESIGN, 2015, 卷号: 100, 页码: 434-443
作者:  Zhang, Shuo;  Wang, Dong;  Fan, Ping-Ping;  Sun, Li-Ping
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2015, 卷号: 31, 页码: 252-256
作者:  Huang, M. L.;  Yang, F.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Yang, Fan;  Zhao, Ning;  Liu, Xiaohua;  Wang, Jingyun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Improved mechanical performance of PBO fiber-reinforced bismaleimide composite using mixed 02/Ar plasma 期刊论文
APPLIED SURFACE SCIENCE, 2014, 卷号: 305, 页码: 630-637
作者:  Liu, Dong;  Chen, Ping;  Yu, Qi;  Ma, Keming;  Ding, Zhenfeng
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/09
A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn-9Zn/Cu interconnect during liquid solid electromigration 期刊论文
SCRIPTA MATERIALIA, 2013, 卷号: 68, 页码: 853-856
作者:  Huang, M. L.;  Zhang, Z. J.;  Zhao, N.;  Zhou, Q.
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/11
Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Zhou, Qiang;  Ma, Haitao;  Zhao, Jie
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electromigration 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2013, 卷号: 42, 页码: 2975-2982
作者:  Huang, M. L.;  Zhou, Q.;  Zhao, N.;  Zhang, Z. J.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11

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