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科研机构
北京大学 [129]
厦门大学 [36]
武汉大学 [2]
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其他 [167]
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2016 [18]
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Trade-offs between stress control and blister avoidance in MEMS devices
其他
2019-01-01
作者:
Sun, Quansheng
;
Wu, Lixiang
;
Wang, Junli
;
Wang, Gaofeng
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2019/12/05
thin-film stress
blister defects
roughness
annealing
silicon nitride
amorphous silicon
Optimization of residual stress of SiO2/organic silicon stacked layer prepared using inductively coupled plasma deposition
其他
2017-01-01
Hsu, Chia-Hsun
;
Cho, Yun-Shao
;
Liu, Ting-Xuan
;
Chang, Hsi-Wei
;
Lien, Shui-Yang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
Organic silicon
Residual stress
Encapsulation
Water vapor transmission rate
Trimethylsilane
LIGHT-EMITTING-DIODES
AMORPHOUS-SILICON
DEGRADATION MECHANISMS
FILMS
TRIMETHYLSILANE
VAPOR
New approaches for energy saving in silicon photonics
其他
2016-01-01
Zhou, Zhiping
;
Deng, Qingzhong
;
Li, Tiantian
;
Li, Xinbai
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
Silicon Photonics
low energy consumption
modulator
WDM filter
MODULATOR
DEVICES
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple
其他
2016-01-01
Guan, Yong
;
Zeng, Qinghua
;
Bian, Yuan
;
Zhong, Xiao
;
Chen, Jing
;
Ma, Shenglin
;
Zhu, Yunhui
;
Jin, Yufeng
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2017/12/03
3D packaging
fine pitch TSV
micro heater
thermocouple
quality evaluation
THROUGH-SILICON VIAS
STACKING TECHNOLOGY
LINER
k.p theory of freestanding narrow band gap semiconductor nanowires
其他
2016-01-01
Luo, Ning
;
Liao, Gaohua
;
Xu, H. Q.
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
FIELD-EFFECT TRANSISTORS
LIGHT-EMITTING-DIODES
BIAS CONDUCTANCE PEAK
CYCLOTRON-RESONANCE
SILICON NANOWIRES
SOLAR-CELLS
ELECTRONIC-PROPERTIES
QUANTUM WIRES
HYBRID DEVICE
INSB
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening
其他
2016-01-01
Guan, Yong
;
Zeng, Qinghua
;
Chen, Jing
;
Ma, Shenglin
;
Jin, Yufeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
TSV
3D packaging
sidewall insulation
electrical properties
CMP
THROUGH-SILICON VIAS
STACKING TECHNOLOGY
LINER
High Frequency Analysis and Characterization of TSVs for High-Speed Integrated Systems
其他
2016-01-01
Miao, Min
;
Fang, Runiu
;
Sun, Xin
;
Cui, Xiaole
;
Jin, Yufeng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
Through silicon via
MOS effect
Noise coupling
SILICON
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging
其他
2016-01-01
Guan, Yong
;
Zeng, Qinghua
;
Chen, Jing
;
Ma, Shenglin
;
Meng, Wei
;
Jin, Yufeng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
through silicon via
packaging
electroplating
additives
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via
其他
2016-01-01
Guan, Yong
;
Zeng, Qinghua
;
Chen, Jing
;
Ma, Shenglin
;
Meng, Wei
;
Jin, Yufeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
through silicon via
3D packaging
DRJE
Enhanced Recrystallization of Ultra-Thin a-Silicon Film by 2-D Confined Lattice Regrowth
其他
2016-01-01
Zhang, Hao
;
Li, Ming
;
Chen, Gong
;
Yang, Yuancheng
;
Huang, Ru
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
Monolithic 3D integration
Amorphous silicon
Two Dimensional (2D) Recrystallization
Capping layer
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