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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 发表日期：2015     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP 期刊论文 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15 Polishing parameters  wafer patterns  chemical mechanical polishing (CMP)  linear system  contact pressure   Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Copper  Elastic moduli  Erosion  Linear systems  Polishing  Topography  Chemical mechanical polishing(CMP)  Contact pressures  High selectivity  Polishing parameters  Polishing processs  Preston coefficients  Selectivity ratio  Wafer patterns   Preparation and dispersion of nanosize ceria in high electrolyte slurry by ball-milling 期刊论文 Integrated Ferroelectrics, 2015, 卷号: 161, 期号: 1, 页码: 36-44 作者:  He, Hanwei* 收藏  |  浏览/下载：12/0  |  提交时间：2019/12/03 Ball milling  Ceria nanoparticle slurry  Chemical-mechanical polishing  Polymer-induced stabilization   Preparation of cobalt-doped colloidal silica abrasives and their chemical mechanical polishing performances on sapphire 期刊论文 MICRO & NANO LETTERS, 2015, 卷号: 10, 页码: 657-661 作者:  Ma, Pan[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 silicon compounds  cobalt  abrasives  time of flight mass spectra  secondary ion mass spectra  scanning electron microscopy  chemical mechanical polishing  surface roughness  atomic emission spectroscopy  X-ray photoelectron spectra  cobalt-doped colloidal silica abrasives  chemical mechanical polishing  seed-induced growth  time-of-flight secondary ion mass spectroscopy  scanning electron microscopy  CMP  sapphire substrates  surface roughness  material removal rate  inductively couple   A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2015, 卷号: 77, 页码: 107-116 作者:  Zhou, Ping;  Dong, Zhigang;  Kang, Renke;  Jin, Zhuji;  Guo, Dongming 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09 Chemical mechanical polishing  Elastohydrodynamic lubrication  Multi-layered elastic theory  Wafer  Material removal rate