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Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Liu, Qianqian;  Hu, Yougen
收藏  |  浏览/下载:7/0  |  提交时间:2020/01/03


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