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CORC

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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ;  Wang BY;  Chen L;  Chen L
收藏  |  浏览/下载：53/0  |  提交时间：2019/11/27
Approximate expression of Young's equation and molecular dynamics simulation for its applicability 期刊论文
CHINESE PHYSICS B, 2019, 卷号: 28, 期号: 1, 页码: AR16801
作者:  Cui SW;  Wei J;  Liu WW;  Zhu RC(朱如曾);  Ping Q
收藏  |  浏览/下载：44/0  |  提交时间：2019/04/11
Microscopic Expression of the Surface Tension of Nano-Scale Cylindrical Liquid and Applicability of the Laplace Equation 期刊论文
JOURNAL OF COMPUTATIONAL AND THEORETICAL NANOSCIENCE, 2015, 卷号: 12, 期号: 2, 页码: 189-193
作者:  Cui SW(崔树稳);  Wei JA;  Xiaosong;  Xu SH(徐升华);  Sun ZW(孙祉伟)
收藏  |  浏览/下载：115/0  |  提交时间：2015/04/28
Expressions of the radius and the surface tension of surface of tension in terms of the pressure distribution for nanoscale liquid threads 期刊论文
CHINESE PHYSICS B, 2013, 卷号: 22, 期号: 12, 页码: 126801/1-126801/3
作者:  Yan H(闫红);  Wei JA(魏久安);  Cui SW(崔树稳);  Zhu RZ(朱如曾)
收藏  |  浏览/下载：82/0  |  提交时间：2014/01/24
Size-dependent surface tension of a cylindrical nanobubble in liquid Ar 期刊论文
CHINESE PHYSICS B, 2012, 卷号: 21, 期号: 8, 页码: 083102
作者:  Yan H(闫红);  Zhu RZ(朱如曾);  Wei JA
收藏  |  浏览/下载：83/0  |  提交时间：2013/01/18

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