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Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering 期刊论文
SMALL, 2018, 卷号: 14, 页码: e1801346
作者:  Wang, Nan[1];  Samani, Majid Kabiri[2];  Li, Hu[3];  Dong, Lan[4];  Zhang, Zhongwei[5]
收藏  |  浏览/下载:7/0  |  提交时间:2019/04/22
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging 期刊论文
MICROELECTRONICS RELIABILITY, 2016, 卷号: 56, 页码: 129-135
作者:  Sun, Shuangxi[1];  Chen, Si[2];  Luo, Xin[3];  Fu, Yifeng[4];  Ye, Lilei[5]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/26
Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 卷号: 5, 页码: 1186-1196
作者:  Chen, Si[1];  Luo, Xin[2];  Jiang, Di[3];  Ye, Lilei[4];  Edwards, Michael[5]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/30
Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application 期刊论文
MICROELECTRONIC ENGINEERING, 2013, 卷号: 103, 页码: 177-180
作者:  Jiang, Di[1];  Wang, Teng[2];  Chen, Si[3];  Ye, Lilei[4];  Liu, Johan[5]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/30
Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests 期刊论文
IEEE ELECTRON DEVICE LETTERS, 2012, 卷号: 33, 页码: 420-422
作者:  Wang, Teng[1];  Chen, Si[2];  Jiang, Di[3];  Fu, Yifeng[4];  Jeppson, Kjell[5]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/30
Formation of three-dimensional carbon nanotube structures by controllable vapor densification 期刊论文
MATERIALS LETTERS, 2012, 卷号: 78, 页码: 184-187
作者:  Wang, Teng[1];  Jiang, Di[2];  Chen, Si[3];  Jeppson, Kjell[4];  Ye, Lilei[5]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/30


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