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浏览/检索结果: 共17条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructure and mechanical property of Ti3AlC2/TiAl3 composite synthesized by hot pressing (EI收录) 会议 Chengdu, China, 作者:  Chen, Wei Ping[1];  Zeng, Yong[1];  Li, Xiao Mei[1];  Xiao, Hua Qiang[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 Aluminum  Ball milling  Bending strength  Cracks  Failure (mechanical)  Fracture toughness  Hot pressing  Mechanical properties  Milling (machining)  Powders  Scanning electron microscopy  Titanium alloys  Titanium compounds  Vickers hardness  X ray diffraction  X ray powder diffraction   Performance analysis of pre-oxidation process direct bonding copper substrate (CPCI-S收录) 会议 作者:  Ning, Honglong[1,2,5];  Hu, Shiben[1,2];  Tao, Ruiqiang[1,2];  Liu, Xianzhe[1,2];  Zeng, Yong[1,2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 pre-oxidation process  direct bonding copper  dielectric dissipation  relative dielectric constant  electronic speckle pattern interferometer   Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Chen, Jing[2];  Jin, Yufeng[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Highly stable and efficient platinum nanoparticles supported on TiO2@Ru-C: investigations on the promoting effects of the interpenetrated TiO (CPCI-S收录) 会议 作者:  Li, Zuopeng[1];  Guo, Yong[1];  Liu, Zhen[2];  Wu, Xin[2];  Zeng, Jianhuang[2] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/11 TiO2@Ru  stability  electrocatalysts  utilization efficiency   Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation   Triple Bands MIMO Antenna for WLAN Applications (CPCI-S收录) 会议 作者:  Jin, Guiping[1];  Huang, Yong[1];  Deng, Chuhong[1];  Zeng, Guangde[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Chen, Jing[1];  Ma, Shenglin[2];  Jin, Yufeng[3] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 TSV  3D packaging  sidewall insulation  electrical properties  CMP   Triple bands MIMO antenna for WLAN applications (EI收录) 会议 Singapore, Singapore, 作者:  Jin, Guiping[1];  Huang, Yong[1];  Deng, Chuhong[1];  Zeng, Guangde[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Antennas  MIMO systems  Monopole antennas  Wireless local area networks (WLAN)   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration (CPCI-S收录) 会议 作者:  Liu, Huan[1];  Zeng, Qinghua[1];  Guan, Yong[1];  Fang, Runiu[1];  Sun, Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Jin, Yufeng[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Hen, Jing C.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 TSV Interposer  Lift-off Process  Interated Passive Devices  Radio Frequency System