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A novel dimensionality reduction algorithm based on Laplace matrix for microbiome data analysis (EI收录) 会议
Washington, DC, United states,
作者:  Fan, Yetian[1];  Jiang, Xingpeng[2];  Hu, Xiaohua[3];  Song, Bo[3];  Ling, Yuan[3]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/11
Research on Improvement of TiAlN Coating on Tribological properties of Miniature Inner Grooved Copper Tubes Drawing Mold Materials (CPCI-S收录) 会议
作者:  Ma, Bo[1];  Liu, Bin[1];  Yuan, Wei[1];  Li, Zongtao[1];  Li, Fuqiu[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
A Novel Design of Unknown Input Observers using Set-theoretic Methods for Robust Fault Detection (CPCI-S收录) 会议
作者:  Xu, Feng[1];  Tan, Junbo[1];  Wang, Xueqian[1];  Puig, Vicenc[2];  Liang, Bin[1,3]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Ubiquitous Robot: A New Paradigm for Intelligence (CPCI-S收录) 会议
作者:  Zhang, Tiantian[1];  Yuan, Bo[1];  Meng, Tao[1];  Ren, Yinghao[1];  Liu, Houde[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Community Structure Analysis Using Label Propagation and Flow-Based Ensemble Learning (CPCI-S收录) 会议
作者:  He, Yunchang[1];  Xu, Jian[1];  Yuan, Bo[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Robust State Estimation and Fault Detection Combining Unknown Input Observer and Set-membership Approach (CPCI-S收录) 会议
作者:  Xu, Feng[1];  Tan, Junbo[1];  Wang, Xueqian[1];  Puig, Vicenc[2];  Liu, Houde
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al (CPCI-S收录) 会议
作者:  Chen, Guo-Liang[1,2];  Zhou, Min-Bo[1,2];  Zhang, Lang[1,2];  Lin, Yuan-Jiang[1,2];  Zhang, Yu-Peng[3]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/11
Analysis of Set-theoretic Unknown Input Observer and Interval Observer in Robust Fault Detection (CPCI-S收录) 会议
作者:  Xu, Feng[1];  Tan, Junbo[1];  Wang, Xueqian[1];  Puig, Vicenc[2];  Liang, Bin[1,3]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Supervised Online Dictionary Learning for Image Separation Using OMP (CPCI-S收录) 会议
作者:  Zhang, Yuxin[1];  Yuan, Bo[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) 会议
作者:  Lin, Yuan-Jiang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11


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