×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
上海大学 [11]
重庆大学 [3]
内容类型
会议论文 [14]
发表日期
2018 [2]
2017 [3]
2016 [2]
2013 [1]
2012 [1]
2011 [2]
更多...
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共14条,第1-10条
帮助
限定条件
内容类型:会议论文
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
MDS Investigation on the Melting and Solidification of Silver Nanoparticles
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Zhang, Yan[1]
;
Zhang, Guoqiang[2]
;
Lu, Xiuzhen[3]
;
Zhang, Qiaoran[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/22
molecular dynamics simulation
silver nanoparticle
solidification
sintering
The influence of sintering process on thermal properties of nano-silver paste
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Lu, Xiuzhen[1]
;
Zhang, Qianran[2]
;
Zehri, Abdelhafid[3]
;
Ke, Wei[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2019/04/22
Thermal conductivity
Sintering temperature
sintering time
nano-silver paste
SiC particles
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Chen, Shujing[1]
;
Shan, Bo[2]
;
Yang, Yiqun[3]
;
Yuan, Guangjie[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/24
Interconnect
CNTs based bumps
CNTs basednTSVs
resistivity
CNTs-Cu nanocomposite
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Huang, Shirong[1]
;
Ke, Wei[2]
;
Yang, Yiqun[3]
;
Ye, Hui[4]
;
Chen, Shujing[5]
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2019/04/24
Graphene protection barrier
Cu-Plated PCB
Reliability
Effect of sintering method on properties of nanosilver paste
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Zhang, Qiaoran[1]
;
Liu, Jiawen[2]
;
Ke, Wei[3]
;
Huang, Shirong[4]
;
Latorre, Marti Gutierrez[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/24
nanosilver
sintering
thermal conductivity
shear strength
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:
Zhang, Yong[1]
;
Huang, Shirong[2]
;
Wang, Nan[3]
;
Bao, Jie[4]
;
Sun, Shuangxi[5]
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/04/26
Thermal properties of TIM using CNTs forest in electronics packaging
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:
Zhang, Dongsheng[1]
;
Liu, Jiawen[2]
;
Sun, Shuangxi[3]
;
Huang, Shirong[4]
;
Bao, Jie[5]
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/04/26
VACNT
heat
dissipation
hotspot
thermal test chip
resistance temperature detector
Characterization of Electrospun Zinc Oxide Nanofibers
会议论文
International Conference on Materials for Renewable Energy and Environment (ICMREE), 2013-08-19
作者:
Chang, Yanyan[1]
;
Zhang, Nanhong[2]
;
Zhuang, Mengke[3]
;
Lu, Xiuzhen[4]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/30
ZnOnanofibers
electrospinning
Morphologies
calcination
Environmental reliability of nano-structured polymer-metal composite thermal interface material
会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:
Lu, Xiuzhen[1]
;
Zhuang, Mengke[2]
;
Zhang, Lei[3]
;
Ye, Lilei[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
Study on the Reliability of Nano-structured Polymer-Metal Composite for Thermal Interface Material
会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:
Zhang, Lei[1]
;
Luo, Xin[2]
;
Lu, Xiuzhen[3]
;
Liu, Johan[4]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/30
©版权所有 ©2017 CSpace - Powered by
CSpace