QQ客服 官方微博 反馈留言

浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microbial Production of Xylitol from D-arabitol by Gluconobacter Oxydans 会议论文 PROCEEDINGS OF THE 2016 INTERNATIONAL CONFERENCE ON BIOLOGICAL ENGINEERING AND PHARMACY (BEP 2016), 2016-01-01 作者:  Zhang, Huanhuan[1];  Yun, Junhua[2];  Magocha, Tinashe Archbold[3];  Yang, Miaomiao[4];  Xue, Yanbo[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/24 Gluconobacter oxydans  xylitol  D-arabitol dehydrogenase  xylitol dehydrogenase   Low Power Readout Circuit for 640 X 512 IRFP A with Dynamic Windowing Readout (CPCI-S收录) 会议论文 2014 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC) 作者:  Zhou, Juanjuan[1];  Zhang, Yacong;  Lu, Wengao;  Chen, Zhongjian;  Fan, Miaomiao 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 Infrared Focal Plane Array (IRFPA)  Readout Circuit  Low Power  Dynamic Windowing Readout   Research and development of hydro-ecological spatial database and management system (EI收录) 会议论文 ISWREP 2011 - Proceedings of 2011 International Symposium on Water Resource and Environmental Protection, Xi'an, China, May 20, 2011 - May 22, 2011 作者:  Zhang, Li[1];  Xu, Bin[2];  Zhang, Yan[3];  Zheng, Miaomiao[4] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Arid regions  Data handling  Ecology  Environmental protection  Geographic information systems  Information systems  Knowledge management  Management information systems  Research and development management  Sustainable development  Water resources   Research on reliability of board level package-on-package in drop test (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Xiaohu, Yao[1];  Zerui, Fan[1];  Miaomiao, Yuan[1];  Xiaoqing, Zhang[1];  Zhiqiang, Li[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Cellular telephone systems  Drops  Electronics packaging  Gages  Impact resistance  Packaging  Printed circuit manufacture  Research  Telecommunication equipment   Research on Reliability of Board Level Package-on-Package in Drop Test (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Yao Xiaohu[1];  Fan Zerui[1];  Yuan Miaomiao[1];  Zhang Xiaoqing[1];  Li Zhiqiang[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16