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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Digital Copyright Works Management System Based on DOSA 会议论文 Hohhot, PEOPLES R CHINA, OCT 22-24, 2018 作者:  Miao, Fang;  Yang, Wenhui;  Fan, Wenjie;  Xie, Yan;  Guo, Quanming 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/13 Hydrolysis of pretreated rice straw with surfactants at low cellulase dosage 会议论文 5th International Conference on Civil, Architectural and Hydraulic Engineering (ICCAHE), Zhuhai, PEOPLES R CHINA, JUL 30-31, 2016 作者:  Liang, Yunshan*;  Huang, Zhijun;  Miao, Shuzhou;  Yuan, Xingzhong;  Jiang, Lihong 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/23 enzymatic hydrolysis  cellulase  surfactant  monorhamnolipid   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文 18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30 作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Failure (mechanical)  Fatigue of materials  Finite element method  Shear stress  Soldering  Stresses  Thermal load  Timing circuits  Global simulation  Interfacial failures  Load condition  Maximum principal stress  Resistance measurement  Solder balls  Thermal mechanical stress  Thermal-mechanical reliability  Three dimensional integrated circuits   Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Xu, Yichao[1,3];  Miao, Min[1,2];  Fang, Runiu[1];  Sun, Xin[1];  Zhu, Yunhui[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/12 Electrical Measurement and Analysis of TSV/RDL for 3D Integration (CPCI-S收录) 会议论文 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 作者:  Sun, Xin[1];  Fang, Runiu[1];  Zhu, Yunhui[1];  Zhong, Xiao[1];  Bian, Yuan[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Investigation of a TSV-RDL In-line Fault-Diagnosis System and Test Methodology for Wafer-level Commercial Production (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Fang, Runiu[1];  Miao, Min[2];  Sun, Xin[1];  Zhu, Yunhui[1];  Wang, Guanjiang[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/12 A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding (CPCI-S收录) 会议论文 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) 作者:  Zhu, Yunhui[1];  Ma, Shenglin[1];  Sun, Xin[1];  Cui, Qinghu[2];  Zhong, Xiao[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via (CPCI-S收录) 会议论文 2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) 作者:  Miao, Min[1,2];  Zhu, Yunhui[1];  Bian, Yuan[1];  Sun, Xin[1];  Ma, Shenglin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 A New Method to Fabricate Sidewall Insulation of TSV Using a Parylene Protection Layer (CPCI-S收录) 会议论文 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009) 作者:  Ji, Ming[1,2];  Zhu, Yunhui[2];  Ma, Shenglin[2];  Sun, Xin[2];  Miao, Min[2,3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17