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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Activity Recognition as a Service for Smart Home: Ambient Assisted Living Application via Sensing Home 会议论文 作者:  Fan, Xiaohu;  Xie, Qubo;  Li, Xuebin;  Huang, Hao;  Wang, Jian 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/05 Transformer Fault Diagnosis Study based on Bayesian Case Library 会议论文 作者:  Peng, Qian;  Yan, Xiaohu;  Liu, Fan;  Cao, Yongxing;  Zhang, Hailong 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05 Bayesian network  Case library  Transformer  Fault diagnostic method  Classifier   Dynamic growth of voids under effects of thermal and vapor pressure in electronic packaging (EI收录) 会议论文 13th International Conference on Fracture 2013, ICF 2013, Beijing, China, June 16, 2013 - June 21, 2013 作者:  Yao, Xiaohu[1];  Mei, Yue[1];  Fan, Xuejun[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Elastic moduli  Electronics packaging  Hydrostatic pressure  Polymers  Vapor pressure  Vapors   Investigation for the Response of PCB Assembly with Five POP Packages during Dropping (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Yu Peng[1];  Fan Zerui[1];  Yao Xiaohu[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Investigation for the response of PCB assembly with five POP packages during dropping (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Yu, Peng[1];  Fan, Zerui[1];  Yao, Xiaohu[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Computer simulation  Computer software  Electronics packaging  Finite element method  Organic pollutants  Packaging  Polychlorinated biphenyls  Printed circuit manufacture   Research on reliability of board level package-on-package in drop test (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Xiaohu, Yao[1];  Zerui, Fan[1];  Miaomiao, Yuan[1];  Xiaoqing, Zhang[1];  Zhiqiang, Li[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Cellular telephone systems  Drops  Electronics packaging  Gages  Impact resistance  Packaging  Printed circuit manufacture  Research  Telecommunication equipment   Research on Reliability of Board Level Package-on-Package in Drop Test (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Yao Xiaohu[1];  Fan Zerui[1];  Yuan Miaomiao[1];  Zhang Xiaoqing[1];  Li Zhiqiang[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16