×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
上海微系统与信息技... [11]
广州生物医药与健康研... [6]
宁波材料技术与工程研... [2]
云南天文台 [2]
沈阳应用生态研究所 [2]
内容类型
期刊论文 [22]
会议论文 [1]
发表日期
2020 [2]
2015 [4]
2012 [3]
2011 [4]
2009 [2]
2008 [2]
更多...
学科主题
Engineeri... [23]
Materials ... [4]
Applied; M... [2]
Applied; P... [2]
Automation... [2]
Condensed ... [2]
更多...
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共23条,第1-10条
帮助
限定条件
学科主题:Engineering
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Nitrogen-Containing Porous Carbon Fibers Prepared from Polyimide Fibers for CO2 Capture
期刊论文
INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 2020, 卷号: 59, 期号: 40, 页码: 18106-18114
作者:
Wang, Xue-Fei
;
Xiong, Long
;
Zhong, Jun-Jun
;
Jin, Lu
;
Yan, Jing-Ling
收藏
  |  
浏览/下载:57/0
  |  
提交时间:2020/12/16
ACTIVATED CARBON
KOH ACTIVATION
DOPED CARBON
ADSORPTION
PERFORMANCE
SELECTIVITY
ADSORBENTS
DIOXIDE
INTERCALATION
KINETICS
Tunable In-Plane Anisotropy in Amorphous Sm-Co Films Grown on (011)-Oriented Single-Crystal Substrates
期刊论文
ENGINEERING, 2020, 卷号: 6, 期号: 2, 页码: 159-164
作者:
Liang, Wenhui
;
Zhou, Houbo
;
Xiong, Jiefu
;
Hu, Fengxia
;
Li, Jia
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/12/16
MAGNETIC-PROPERTIES
Phytomolecule icaritin incorporated PLGA/TCP scaffold for steroid-associated osteonecrosis: Proof-of-concept for prevention of hip joint collapse in bipedal emus and mechanistic study in quadrupedal rabbits
期刊论文
BIOMATERIALS, 2015, 卷号: 59, 页码: 125-143
Qin, Ling
;
Yao, Dong
;
Zheng, Lizhen
;
Liu, Wai-Ching
;
Liu, Zhong
;
Lei, Ming
;
Huang, Le
;
Xie, Xinhui
;
Wang, Xinluan
;
Chen, Yang
;
Yao, Xinsheng
;
Peng, Jiang
;
Gong, He
;
Griffith, James F.
;
Huang, Yanping
;
Zheng, Yongping
;
Feng, Jian Q.
;
Liu, Ying
;
Chen, Shihui
;
Xiao, Deming
;
Wang, Daping
;
Xiong, Jiangyi
;
Pei, Duanqing
;
Zhang, Peng
;
Pan, Xiaohua
;
Wang, Xiaohong
;
Lee, Kwong-Man
;
Cheng, Chun-Yiu
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2016/12/16
Convolutional Neural Networks in Automatic Recognition of Trans-differentiated Neural Progenitor Cells under Bright-field Microscopy
期刊论文
2015 FIFTH INTERNATIONAL CONFERENCE ON INSTRUMENTATION AND MEASUREMENT, COMPUTER, COMMUNICATION AND CONTROL (IMCCC), 2015, 页码: 122-126
作者:
Pang, Hongwen
;
Xiong, Yucui
;
Jiang, Bo
;
Wang, Xinyuan
;
Luo, Jianzhong
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2018/12/13
Convolutional Neural Networks in Automatic Recognition of Trans-differentiated Neural Progenitor Cells under Bright-field Microscopy
期刊论文
2015 FIFTH INTERNATIONAL CONFERENCE ON INSTRUMENTATION AND MEASUREMENT, COMPUTER, COMMUNICATION AND CONTROL (IMCCC), 2015, 页码: 122-126
Jiang, Bo
;
Wang, Xinyuan
;
Luo, Jianzhong
;
Zhang, Xiao
;
Xiong, Yucui
;
Pang, Hongwen
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2016/12/16
Phytomolecule icaritin incorporated PLGA/TCP scaffold for steroid-associated osteonecrosis: Proof-of-concept for prevention of hip joint collapse in bipedal emus and mechanistic study in quadrupedal rabbits
期刊论文
BIOMATERIALS, 2015, 卷号: 59, 页码: 125-143
作者:
Chen, Shihui
;
Xiao, Deming
;
Wang, Daping
;
Xiong, Jiangyi
;
Pei, Duanqing
收藏
  |  
浏览/下载:35/0
  |  
提交时间:2018/12/13
Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding
期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491
Wu, GQ
;
Xu, DH
;
Xiong, B
;
Wang, YC
;
Wang, YL
;
Ma, YL
收藏
  |  
浏览/下载:102/0
  |  
提交时间:2013/04/23
Bulk mode
glass frit bonding
microelectromechanical systems (MEMS)
redistribution
resonators
silicon bumps
vacuum package
wafer-level package
Isotropic Silicon Etching With XeF2 Gas for Wafer-Level Micromachining Applications
期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1436-1444
Xu, DH
;
Xiong, B
;
Wu, GQ
;
Wang, YC
;
Sun, X
;
Wang, YL
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2013/04/23
Design rule
isotropic etching
microelectromechanical systems (MEMS)
micromachining
wafer level
XeF2 gas
Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps
期刊论文
IEEE ELECTRON DEVICE LETTERS, 2012, 卷号: 33, 期号: 8, 页码: 1177-1179
Wu, GQ
;
Xu, DH
;
Xiong, B
;
Wang, YL
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2013/04/23
Redistribution of electrical interconnection
silicon bumps
wafer-level packaging
3-D packaging
Low-temperature Au/a-Si wafer bonding
期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2011, 卷号: 21, 期号: 1, 页码: 15013
Jing,ER
;
Xiong,B
;
Wang,YL
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2012/04/12
IOP PUBLISHING LTD
©版权所有 ©2017 CSpace - Powered by
CSpace