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The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin
收藏  |  浏览/下载:71/0  |  提交时间:2021/02/02
Relationship between the sharp decrease in dust storm frequency over East Asia and the abrupt loss of Arctic sea ice in the early 1980s 期刊论文
GEOLOGICAL MAGAZINE, 2020, 卷号: 157, 期号: 5, 页码: 729-740
作者:  Shang, Ke;  Liu, Xiaodong
收藏  |  浏览/下载:41/0  |  提交时间:2020/06/23


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