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科研机构
大连理工大学 [8]
内容类型
会议论文 [8]
发表日期
2017 [8]
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发表日期:2017
内容类型:会议论文
专题:大连理工大学
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DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP
会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12
作者:
Yao, Mingjun
;
Yu, Daquan
;
Zhao, Ning
;
Fan, Jun
;
Xiao, Zhiyi
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Hybrid bonding
3D packaging
Bump
Polyimide
Dry film
Adaptive pre-compensation of the contouring error for high-precision parametric curved contour following
会议论文
ASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017, Tampa, FL, United states, 2017-11-03
作者:
Ma, Jian-Wei
;
Song, De-Ning
;
Jia, Zhen-Yuan
;
Zhang, Ning
;
Hu, Guo-Qing
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/03
Power Generation Scheduling for Wind-Solar-Thermal Power Long Distance Consumption Based on Game-Theory
会议论文
2017 IEEE 7TH ANNUAL INTERNATIONAL CONFERENCE ON CYBER TECHNOLOGY IN AUTOMATION, CONTROL, AND INTELLIGENT SYSTEMS (CYBER), 2017-01-01
作者:
Ma, Tingting
;
Yuan, Tiejiang
;
Sun, Yiqian
;
Chen, Ning
;
Liu, Xiaofeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Guo, Bingfeng
;
Jiang, Chengrong
;
Kunwar, Anil
;
Chen, Jun
;
Zhao, Ning
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/03
Synchrotron radiation
heat preservation stage
microstructure
Cu addition
mechanism
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Guo, Bingfeng
;
Jiang, Chengrong
;
Kunwar, Anil
;
Zhao, Ning
;
Chen, Jun
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/03
high pressure air
synchrotron radiation
microstructure
Ag concentration
growth activity energy
mechanism
Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Zhong, Yi
;
Zhao, Ning
;
Dong, Wei
;
Ma, Haitao
;
Wang, Yunpeng
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/03
soldering
IMC grain
orientation
temperature gradient
anisotropy
electron backscattering diffraction (EBSD)
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Zhao, Ning
;
Wang, Mingyao
;
Zhong, Yi
;
Ma, Haitao
;
Wang, Yunpeng
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/03
Sn-Zn solder
Interfacial reaction
Cu-Ni cross-interaction
Temperature gradient
Intermetallic compound
Modeling and Simulation of Gas Turbine Starter and Fuel Control System
会议论文
PROCEEDINGS OF THE 36TH CHINESE CONTROL CONFERENCE (CCC 2017), 2017-01-01
作者:
Ma, Song
;
Tan, Jianguo
;
Ning, Yongqian
;
Gao, Zichang
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/03
Gas turbine starter
Fuel control system
Mechanical hydntulic modeling
Component-level model
Simulation
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