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Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders 会议论文
29th IEEE International Conference on Microelectronic Test Structures (ICMTS)
作者:  Jeppson, Kjell[1];  Bao, Jie[2];  Huang, Shirong[3];  Zhang, Yong[4];  Sun, Shuangxi[5]
收藏  |  浏览/下载:19/0  |  提交时间:2019/04/26
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5]
收藏  |  浏览/下载:11/0  |  提交时间:2019/04/26
Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders 会议论文
29th IEEE International Conference on Microelectronic Test Structures, ICMTS 2016, 2016-03-28
作者:  Jeppson, Kjell[1];  Bao, Jie[2];  Huang, Shirong[3];  Zhang, Yong[4];  Sun, Shuangxi[5]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/26
Thermal properties of TIM using CNTs forest in electronics packaging 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:  Zhang, Dongsheng[1];  Liu, Jiawen[2];  Sun, Shuangxi[3];  Huang, Shirong[4];  Bao, Jie[5]
收藏  |  浏览/下载:12/0  |  提交时间:2019/04/26


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