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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2016    内容类型：会议论文    专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research on process reliability design method 会议论文 22nd ISSAT International Conference on Reliability and Quality in Design, Los Angeles, CA, United states, 2016-08-04 作者:  Liu, Xuejun;  Huang, Min;  Yi, Jun 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/30 Efficiency Improvement of Overall PMSM-Inverter System Based on Artificial Bee Colony Algorithm Under Full Power Range 会议论文 13th Joint Magnetism and Magnetic Materials (MMM)/Intermag Conference, San Diego, CA, 2016-07-01 作者:  Ding, Xiaofeng;  Liu, Guanliang;  Du, Min;  Guo, Hong;  Duan, Chongwei 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Artificial bee colony (ABC) algorithm  different direct-axis currents (Ids)  fundamental and harmonic losses  inverter  permanent magnet synchronous motor (PMSM)  switching frequencies (SFs)   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文 18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30 作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Failure (mechanical)  Fatigue of materials  Finite element method  Shear stress  Soldering  Stresses  Thermal load  Timing circuits  Global simulation  Interfacial failures  Load condition  Maximum principal stress  Resistance measurement  Solder balls  Thermal mechanical stress  Thermal-mechanical reliability  Three dimensional integrated circuits   Elastic Resource Provisioning for Cloud Based on Docker 会议论文 International Conference on Artificial Intelligence and Computer Science (AICS), Guilin, PEOPLES R CHINA 作者:  Qiu, Shi-da;  Zhu, Ming-fa;  Qin, Guang-jun;  Xiao, Li-min;  Song, Bin 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/30 Elastic resource provisioning  Cloud computing  Benefit analysis  Docker