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Investigation of TaN as the wet etch stop layer for HKMG-last integration in the 22 nm and beyond nodes CMOS technology 期刊论文
Vacuum, 2015
作者:  Cui HS(崔虎山);  Luo J(罗军);  Xu J(许静);  Gao JF(高建峰);  Xiang JJ(项金娟)
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