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科研机构
大连理工大学 [8]
内容类型
专利 [8]
发表日期
2015 [8]
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浏览/检索结果:
共8条,第1-8条
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发表日期:2015
内容类型:专利
专题:大连理工大学
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Plasma jet device with brittle material thickness regulation function, has gas source that conveys gas to plasma generator, where depth of low active particle concentration is less than depth of brittle material surface.
专利
申请日期: 2015-01-01, 公开日期: 2015-03-25
作者:
HUANG S JIN Z LIU X XU W YANG X CHE
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浏览/下载:6/0
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提交时间:2019/12/09
Preparation of full metallic compound interconnecting welding point involves taking first substrate, plating, sputtering, annealing, sputtering, vapor depositing, evaporating, adding second substrate, plating, sputtering and welding.
专利
申请日期: 2015-01-01, 公开日期: 2015-06-10
作者:
HUANG M YANG F ZHANG Z ZHAO N HUANG F
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  |  
浏览/下载:2/0
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提交时间:2019/12/09
Separating copper, cadmium and cadmium-bronze contaminated sludge involves performing bioelectrochemical process utilizing bioelectrochemical reactor equipped with microbial electrolysis cell, anolyte and series resistor.
专利
申请日期: 2015-01-01, 公开日期: 2015-04-01
作者:
HUANG L QUAN X PAN Y YANG J WANG Q
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浏览/下载:7/0
  |  
提交时间:2019/12/09
Three-dimensional vertical through-hole filling intermetallic compound package, has package body made of brazing filler metal, where brazing filler metal is selected from group consisting of tin filler metal and indium filler metal.
专利
申请日期: 2015-01-01, 公开日期: 2015-06-10
作者:
HUANG M MA H YANG F ZHANG F ZHANG Z
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浏览/下载:3/0
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提交时间:2019/12/09
Stress gradient corrosion electrolytic pool device, has tubes connected with each other in series and mounted with reference electrode, and regulating screw rod whose front end is mounted with clamping block to load working electrode.
专利
申请日期: 2015-01-01, 公开日期: 2015-04-29
作者:
HUANG Y LI Y WANG Y YANG H
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浏览/下载:6/0
  |  
提交时间:2019/12/09
Bend considering influence stress corrosion test device for constant temperature matching experiment device, has coating metal plate connected with corrosion environment detection device for detecting anti-corrosive coating function.
专利
申请日期: 2015-01-01, 公开日期: 2015-04-29
作者:
HUANG Y LI Y WANG Y YANG H
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  |  
浏览/下载:7/0
  |  
提交时间:2019/12/09
Method for preparing inter-metallic compound thin film involves forming temperature gradient between the metal substrates, and performing metal solder generating reaction between the two substrates is performed to form thin film.
专利
申请日期: 2015-01-01, 公开日期: 2015-06-03
作者:
HUANG M YANG F ZHANG Z ZHAO J ZHAO N
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浏览/下载:3/0
  |  
提交时间:2019/12/09
Preparation of intermetallic compound thin film involves providing first metal substrate, subjecting first metal substrate to plating, sputtering, vapor deposition, or brazing with filler metal layer, and providing second metal substrate.
专利
申请日期: 2015-01-01, 公开日期: 2015-05-27
作者:
HUANG M MA H YANG F ZHANG Z ZHAO J
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浏览/下载:4/0
  |  
提交时间:2019/12/09
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