QQ客服 官方微博 反馈留言

浏览/检索结果: 共8条，第1-8条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Properties of Cu-Co-P/gamma-Al2O3 catalysts for efficient hydrogen generation by hydrolysis of alkaline NaBH4 solution 期刊论文 INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2017, 卷号: 42, 页码: 5749-5757 作者:  Li, Zhong[1];  Wang, Lina[2];  Zhang, Yue[3];  Xie, Guangwen[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/24 Electroless deposition  NaBH4  Catalysts  Hydrolysis   Conductive aramid fiber with Ni-Cu composite coating prepared using the metalation swelling method 期刊论文 FIBERS AND POLYMERS, 2013, 卷号: 14, 页码: 453-458 作者:  Liang, Jingjing[1];  Zou, Xinguo[2];  Shao, Qinsi[3];  Sun, Jinliang[4];  Tang, Zhiyong[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 Nickel-copper composite coating  Metalation swelling  Aramid fiber  Electroless plating  Conductive fiber   Sintered Cu alloyed stainless steels and their corrosion behavior 期刊论文 JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2008, 卷号: 17, 页码: 780-784 作者:  Wang, Jun'an[1];  He, Ying[2];  He, Peng[3];  Zhou, Bangxin[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06 corrosion resistance  Cu-electroless plating  sintered stainless steel   Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 期刊论文 MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2006, 卷号: 135, 页码: 134-140 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 lead-free solder  ENIG surface finish  intermetallic compound (IMC)   High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallization 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 425, 页码: 191-199 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 lead-free solder  electroless Ni(P)  interfacial reaction  inter-metallic compound (IMC)   Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 会议论文 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni (P) metallization 会议论文 56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings, 2006-05-30 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Lai, Zonghe[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Effect of additives on hole filling characteristics of electroless copper plating 期刊论文 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2004, 卷号: 43, 页码: 7000-7001 作者:  Wang, Zenglin[1];  Yaegashi, Osamu[2];  Sakaue, Hiroyuki[3];  Takahagi, Takayuki[4];  Shingubara, Shoso[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 electroless Cu plating  bottom-up filling  additives  damascene process