QQ客服 官方微博 反馈留言

浏览/检索结果: 共4条，第1-4条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of thickness of interfacial IMC layer and solder mask layer on mechanical reliability of micro-scale BGA structure interconnects (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Qin, Hong-Bo[1];  Li, Xun-Ping[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/15 Brittle fracture  Crack tips  Cracks  Electronics packaging  Stress intensity factors   Influence of Thickness of Interfacial IMC Layer and Solder Mask Layer on Mechanical Reliability of Micro-Scale BGA Structure Interconnects (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Qin, Hong-Bo[1];  Li, Xun-Ping[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Influences of the Initial Thickness of the Interfacial IMC Layer on Electromigration Behavior of Cu/Sn/Cu Microscale Joints (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Yue, Wu[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Xu, Guang-Sui[1];  Cao, Shan-Shan[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Yue, Wu[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Xu, Guang-Sui[1];  Cao, Shan-Shan[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Electromigration  Electronics packaging