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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation   Physical modeling of topographic maps by paper-based 3D printer using NSDTF-DEM data (EI收录) 会议 Hangzhou, China, 作者:  He, Liuxi[1,3];  Yu, Zhaohui[1,2];  Chen, Guangxue[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Electronic document exchange  Maps  Packaging materials  Printing machinery  Printing presses  Ship conversion  Surveying  Visual communication   Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Chen, Jing[1];  Ma, Shenglin[2];  Jin, Yufeng[3] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 TSV  3D packaging  sidewall insulation  electrical properties  CMP   Visualization of large-size model based on paper-based 3D printing (EI收录) 会议 Hangzhou, China, 作者:  Yuan, Jiangping[1];  Chen, Guangxue[1];  Liao, Junhao[1];  Yu, Zhaohui[1,2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/11 3D printers  Packaging materials  Visual communication  Visualization   Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Chen, Jing[1];  Ma, Shenglin[2];  Meng, Wei[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 through silicon via  3D packaging  DRJE   Electrical Measurement and Analysis of TSV/RDL for 3D Integration (CPCI-S收录) 会议论文 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 作者:  Sun, Xin[1];  Fang, Runiu[1];  Zhu, Yunhui[1];  Zhong, Xiao[1];  Bian, Yuan[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Advanced Failure Analysis Techniques for SiP Defect Location and Mechanism Analysis (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Lin, Na[1];  Chen, Yuan;  Li, Guoyuan[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 SiP  failure analysis  defect location  3D X-ray  LIT  FIB   Influence of Geometry of Microbump Interconnects on Thermal Stress and Fatigue Life of Interconnects in Copper Filled Through Silicon Via Str (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Qin, Hong-Bo[1];  Yuwen, Hui-Hui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 TSV  3D packaging  microbump interconnect  fatigue life  finite element simulation   3D printing of topographic map based on UV Ink-Jet printer (EI收录) 会议论文 Applied Mechanics and Materials, Tianjin, China, November 23, 2013 - November 25, 2013 作者:  Wang, Huan Mei[1];  Chen, Guang Xue[1];  Zhang, Wen Bo[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/12 Ink jet printers  Packaging machines  Printing  Three dimensional