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CORC

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Development of indium bumping technology through AZ9260 resist electroplating 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2010, 卷号: 20, 期号: 5, 页码: 55035-55035
Huang, QP; Xu, GW; Yuan, Y; Cheng, X; Luo, L
收藏  |  浏览/下载：9/0  |  提交时间：2012/03/24
The properties of high-k gate dielectric films deposited on HRSOI 期刊论文
MICROELECTRONIC ENGINEERING, 2009, 卷号: 86, 期号: 12, 页码: 2404-2407
Cheng, XH; Xu, DP; Song, ZR; He, DW; Yu, YH; Zhao, QT; Shen, DS
收藏  |  浏览/下载：14/0  |  提交时间：2012/03/24
YOUNG'S MODULUS SIZE EFFECT OF SCS NANOBEAM BY TENSILE TESTING IN ELECTRON MICROSCOPY 期刊论文
2009 IEEE SENSORS, VOLS 1-3, 2009, 页码: 205-208
Jin, QH; Li, T; Wang, YL; Li, XX; Yang, H; Xu, FF
收藏  |  浏览/下载：10/0  |  提交时间：2011/12/17
MEMS Vertical Probe Cards With Ultra Densely Arrayed Metal Probes for Wafer-Level IC Testing 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2009, 卷号: 18, 期号: 4, 页码: 933-941
Wang, F; Cheng, R; Li, XX
收藏  |  浏览/下载：8/0  |  提交时间：2011/12/17
Silicon cantilever arrays with by-pass metal through-silicon-via (TSV) tips for micromachined IC testing probe cards 期刊论文
MICROELECTRONIC ENGINEERING, 2009, 卷号: 86, 期号: 11, 页码: 2211-2216
Wang, F; Li, XX; Cheng, R; Jiang, KW; Feng, SL
收藏  |  浏览/下载：9/0  |  提交时间：2011/12/17
Microcantilever Probe Cards With Silicon and Nickel Composite Micromachining Technique for Wafer-Level Burn-In Testing 期刊论文
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 卷号: 32, 期号: 2, 页码: 468-477
Wang, F; Li, XX; Feng, SL
收藏  |  浏览/下载：11/0  |  提交时间：2011/12/17
MEMS Vertical Probe Cards With Ultra Densely Arrayed Metal Probes for Wafer-Level IC Testing 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2009, 卷号: 18, 期号: 4, 页码: 933-941
Wang, F; Cheng, R; Li, XX
收藏  |  浏览/下载：7/0  |  提交时间：2011/12/17
Thermal Management and testing of MCM with embedded chip in Silicon Substrate 期刊论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, 页码: 165-170
Geng, F; Tang, JJ; Luo, L
收藏  |  浏览/下载：12/0  |  提交时间：2012/03/24
MEMS Vertical Probe Cards with Both Line-arrayed and Area-arrayed Ultra-dense Metal Tips for Wafer-level IC Testing 期刊论文
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST, 2008, 页码: 503-506
Wang, F; Cheng, R; Li, XX
收藏  |  浏览/下载：15/0  |  提交时间：2011/12/17
Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2007, 卷号: 36, 期号: 9, 页码: 1129-1136
Xia, Y; Lu, C; Xle, X
收藏  |  浏览/下载：13/0  |  提交时间：2012/03/24

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