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Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device 期刊论文
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 卷号: 32, 期号: 3, 页码: 125-132
Cao, YH; Ning, WG; Luo, L
收藏  |  浏览/下载:17/0  |  提交时间:2012/03/24
Exploration of a new wafer-level hermetic sealing method by Cu/Sn isothermal solidification technique for MEMS/NEMS devices 期刊论文
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II, 2005, 卷号: 5650, 页码: 332-336
Du, MH; Xu, W; Luo, L
收藏  |  浏览/下载:14/0  |  提交时间:2012/03/24
Microstructure, magnetization and dc transport properties of MTG-YBa1.8 Na0.2Cu3Oy crystal 期刊论文
SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2001, 卷号: 14, 期号: 7, 页码: 511-516
Wang, ZH; Zou, XW; Fang, J; Yang, T; Xu, XN; Wu, XF; Luo, H; Huang, Z; Chen, JL; Qiu, L; Ding, SY; Zhang, H; Yao, XX
收藏  |  浏览/下载:13/0  |  提交时间:2012/03/24
TEM STUDY OF LAYERED DEFECTS IN HIGH J(C) MTG-YBCO 期刊论文
SCIENCE IN CHINA SERIES A-MATHEMATICS PHYSICS ASTRONOMY & TECHNOLOGICAL SCIENCES, 1995, 卷号: 38, 期号: 3, 页码: 317-323
WANG, GY(王葛亚); SHI, TS(施天生); FU, YX(傅耀先); CAI, CB(蔡传兵); YANG, HC(杨宏川)
收藏  |  浏览/下载:12/0  |  提交时间:2012/03/25
TRANSFORMATION KINETICS OF YBA2CU3OX IN SAMPLES PRODUCED BY THE RAPID-QUENCHING TECHNIQUE 期刊论文
SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 1992, 卷号: 5, 期号: 7, 页码: 427-430
CHEN, YX; ZHANG, JH; WU, ZL
收藏  |  浏览/下载:8/0  |  提交时间:2012/03/25


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