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Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载:37/0  |  提交时间:2017/01/15
A compact Force Sensor with Low Temperature Drift Design Using a Standard CMOS Process 会议论文
5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
作者:  Benxian Peng;  Ting Yu;  Fengqi Yu;  Yuchun Feng
收藏  |  浏览/下载:9/0  |  提交时间:2015/08/21


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