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| Multidimensional Ternary Hybrids with Synergistically Enhanced Electrical Performance for Conductive Nanocomposites and Prosthetic Electronic Skin 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018
作者: Zhao, Tao; Wang, Hui; Liang, Xianwen; Zhou, Fengrui; Zhu, Pengli
  收藏 | 浏览/下载：42/0 | 提交时间：2019/01/31 |
| Enhancement of thermal conductivity of epoxy adhesives by ball milling copper flakes 会议论文
Harbin, China
作者: Lu Xu; Hao-Ran Wen; Futao Zhang; Matthew M.F. Yuen; Xian-Zhu Fu
收藏 | 浏览/下载：17/0 | 提交时间：2018/02/02 |
| Comparative study of anhydride-based and amine-based underfill materials for flip chip applications 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者: Gang Li; Pengli Zhu; Qian Guo; Tao Zhao; Daniel Lu
收藏 | 浏览/下载：13/0 | 提交时间：2017/01/15 |
| Underfill Technology for Fine Pitch Flip Chip Application 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Pengli Zhu; Gang Li; Qian Guo; Tao Zhao; Daoqiang Lu
收藏 | 浏览/下载：41/0 | 提交时间：2017/01/15 |
| Tuneable cellular-structured 3D graphene aerogel and its effect on electromagnetic interference shielding performance and mechanical properties of epoxy composites 期刊论文
RSC ADVANCES, 2016
作者: Wan, Yan-Jun; Yu, Shu-Hui; Yang, Wen-Hu; Zhu, Peng-Li; Sun, Rong
收藏 | 浏览/下载：16/0 | 提交时间：2017/01/13 |
| Spherical and flake-like BN filled epoxy composites: morphological effect on the thermal conductivity, thermo-mechanical and dielectric properties 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015
作者: Liang Huang; Pengli Zhu; Gang Li; Fengrui Zhou; Daoqiang Lu
收藏 | 浏览/下载：26/0 | 提交时间：2016/01/27 |
| One-pot synthesis of bimodal silica nanospheres and their effects on the rheological and thermal– mechanical properties of silica–epoxy composites† 期刊论文
RSC Advances, 2015
作者:
收藏 | 浏览/下载：21/0 | 提交时间：2016/01/27 |
| A systematic study on electrical properties of the BaTiO3-epoxy composite with different sized BaTiO3 as fillers 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2015
作者: Yang Wenhu; Yu Shuhui; Luo Suibin; Sun Rong; Liao WeiHsin
收藏 | 浏览/下载：13/0 | 提交时间：2016/01/27 |
| Thermally conductive adhesives based on silver coated copper flake fillers 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者: Jin-Qi Xie; Hu-Ming Ren; Kai Zhang; Matthew M.F.Yuen; S.W.Ricky Lee
收藏 | 浏览/下载：12/0 | 提交时间：2016/01/27 |
| The effect of interfacial state on the thermal conductivity of functionalized Al2O3 filled glass fibers reinforced polymer composites 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2015
作者: Yao Yimin; Zeng Xiaoliang; Guo Kun; Sun Rong; Xu JianBin
收藏 | 浏览/下载：26/0 | 提交时间：2016/01/27 |
