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CORC

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Core-shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction. 期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2018
作者:  Liu, Shaoqing;  Zhao, Bo;  Jiang, Li;  Zhu, Yan-Wu;  Fu, Xian-Zhu
收藏  |  浏览/下载：12/0  |  提交时间：2019/01/31
Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN. 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2017
作者:  Hu, Jiantao;  Huang, Yun;  Yao, Yimin;  Pan, Guiran;  Sun, Jiajia
收藏  |  浏览/下载：20/0  |  提交时间：2018/02/02
Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong
收藏  |  浏览/下载：14/0  |  提交时间：2018/02/02
Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载：37/0  |  提交时间：2017/01/15
Ice-Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement 期刊论文
SMALL, 2015
作者:  Zeng, Xiaoliang;  Yao, Yimin;  Gong, Zhengyu;  Wang, Fangfang;  Sun, Rong
收藏  |  浏览/下载：61/0  |  提交时间：2016/01/27
A novel temporary adhesive for thin wafer handling 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Shuai, Xingtian;  Sun, Rong;  Zhang, Guoping;  Deng, Libo
收藏  |  浏览/下载：18/0  |  提交时间：2015/09/01
Through-Silicon via Placement with Shuffled Frog Leap Algorithm 会议论文
2014 IEEE International Conference on Robotics and Biomimetics, IEEE ROBIO 2014, 印度尼西亚
作者:  Su, Shaobo;  Li, Huiyun;  Xu, Guoqing
收藏  |  浏览/下载：12/0  |  提交时间：2015/09/01
Stochastic Wire-Length Model with TSV Placement on Periphery Area 会议论文
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, 新加坡
作者:  Ling, Jianhui;  Li, Huiyun;  Xu, Guoqing;  Xiong, Liying
收藏  |  浏览/下载：17/0  |  提交时间：2015/09/01
Wetting Behavior of Polymer Liquid in Insulation Process for Through Silicon Via 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China
作者:  Zhao Songfang;  Zhang Guoping;  Sun Rong;  Lee S. W. Ricky
收藏  |  浏览/下载：13/0  |  提交时间：2015/08/27
Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via 会议论文
2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United states
作者:  Zhao Songfang;  Zhang Guoping;  Peng Chongnan;  Sun Rong;  Lee S. W. Ricky
收藏  |  浏览/下载：48/0  |  提交时间：2015/08/27

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