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科研机构
大连理工大学 [94]
内容类型
期刊论文 [71]
会议论文 [23]
发表日期
2019 [7]
2018 [11]
2017 [7]
2016 [8]
2015 [9]
2014 [5]
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专题:大连理工大学
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Crystallization behavior of iron-containing intermetallic compounds in al-si alloy under ultrasonic treatment
会议论文
Light Metals Symposium held at the TMS Annual Meeting and Exhibition, 2019, San Antonio, TX, United states, 2019-03-10
作者:
Zhang, Yubo
;
Wang, Tongmin
;
Li, Tingju
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/12/02
Diffusion-Limited Formation of Nonequilibrium Intermetallic Nanophase for Selective Dehydrogenation
期刊论文
NANO LETTERS, 2019, 卷号: 19, 页码: 4380-4383
作者:
Zhang, Guanghui
;
Ye, Chenliang
;
Liu, Wei
;
Zhang, Xiaoben
;
Su, Dangsheng
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/02
Nonequilibrium phase
intermetallic compounds
diffusion controlled
light alkane dehydrogenation
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yanfeng
;
Qu, Lin
;
Ma, Haitao
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2019/12/02
Binary alloys
Copper alloys
Film thickness
Intermetallics
Lead-free solders
Molluscs
Ostwald ripening
Soldering
Tin alloys, Cooling rates
Furnace cooling
Grain diameter
Growth behavior
Growth behaviour
Layer thickness
Non-uniformities
Reflow temperatures, Cooling
Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints
期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yanfeng
;
Yao, Jinye
;
Wu, Yingchao
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2019/12/02
Electronic materials
Intermetallic compounds
Crystal growth
Thermogravimetric analysis
Diffusion
Finite element method
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux
期刊论文
THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Yao, Jinye
;
Ma, Haitao
;
Wang, Yunpeng
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2019/12/02
Solder
Intermetallic compounds film
Nanoparticles
Growth kinetics
Finite element method
Acid-tolerant intermetallic cobalt-nickel silicides as noble metal-like catalysts for selective hydrogenation of phthalic anhydride to phthalide
期刊论文
CATALYSIS SCIENCE & TECHNOLOGY, 2019, 卷号: 9, 页码: 1108-1116
作者:
Zhang, Liangliang
;
Chen, Xiao
;
Chen, Yujing
;
Peng, Zhijian
;
Liang, Changhai
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2019/12/02
Acid resistance
Chemical vapor deposition
Cobalt
Corrosion resistance
Hydrogenation
Intermetallics
Nickel
Nickel compounds
Precious metals
Silicides, Activity measurements
Chemoselective hydrogenation
Intermetallic compound catalysts
Microwave assisted chemical vapor depositions
Noble metal catalysts
Phthalic anhydrides
Selective hydrogenation
Transition metal catalysts, Catalyst activity
Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints
期刊论文
METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Yao, Jinye
;
Wang, Yanfeng
;
Ma, Haitao
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2019/12/02
TiO2 nanoparticles
Intermetallic compounds
Ostwald ripening
von Mises stress
Solder
Interface
Study on Microstructure and Properties of AZ31/6061 GTAW Butt Joints According to Mg-Cd-Al Ternary System
期刊论文
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2018, 卷号: 27, 页码: 5879-5888
作者:
Liu, Liming
;
Lv, Xinze
;
Wang, Hongyang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/02
fracture
intermetallic compounds
Mg
Al welding
Mg-Cd-Al multi-component alloy
microstructure
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Yao, Jinye
;
Li, Hua
;
Huang, Ru
;
Qi, Xiao
;
Wang, Boyin
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Cu5Zn8
interfacial intermetallic compounds
lead-free solder
growth kinetics
Interfacial microstructure and mechanical property of TC4 titanium alloy/316L stainless steel joint brazed with Ti-Zr-Cu-Ni-V amorphous filler metal
期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2018, 卷号: 35, 页码: 382-395
作者:
Xia, Yueqing
;
Li, Peng
;
Hao, Xiaohu
;
Dong, Honggang
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/02
Vacuum brazing
Amorphous filler metal
Interfacial microstructure
Intermetallic compounds (IMCs)
Shear strength
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