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CORC

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Investigations on A New Syntihetic Test of DC Vacuum Circuit Breaker 会议论文
PROCEEDINGS OF 2018 IEEE 3RD ADVANCED INFORMATION TECHNOLOGY, ELECTRONIC AND AUTOMATION CONTROL CONFERENCE (IAEAC 2018), 2018-01-01
作者:  Liang, Deshi;  Guo, Xingyu;  Gao, Yang;  Zou, Jiyan;  Wang, Zhisen
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Investigations on Electromagnetic Operating Mechanism of DC Vacuum Circuit Breaker 会议论文
PROCEEDINGS OF 2018 IEEE 3RD ADVANCED INFORMATION TECHNOLOGY, ELECTRONIC AND AUTOMATION CONTROL CONFERENCE (IAEAC 2018), 2018-01-01
作者:  Liang, Deshi;  Dong, Wenliang;  Zhang, Sheng;  Zou, Jiyan;  Wang, Yanping
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Reform and renewables in China: The architecture of Yunnan's hydropower dominated electricity market 期刊论文
RENEWABLE & SUSTAINABLE ENERGY REVIEWS, 2018, 卷号: 94, 页码: 682-693
作者:  Cheng, Chuntian;  Chen, Fu;  Li, Gang;  Ristic, Bora;  Mirchi, Ali
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Systematic study on the mechanical and electric behaviors of the nonbuckling interconnect design of stretchable electronics 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2018, 卷号: 61
作者:  Liu, Hao;  Xue, RiYe;  Hu, JianQiao;  Ping, XueCheng;  Wu, HuaPing
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2018, 卷号: 216, 页码: 130-135
作者:  Zhong, Y.;  Zhao, N.;  Dong, W.;  Wang, Y. P.;  Ma, H. T.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 19-26
作者:  Wang, Junqiang;  Wang, Qian;  Wu, Zijian;  Wang, Dejun;  Cai, Jian
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
Passivation effects of phosphorus on 4H-SiC (0001) Si dangling bonds: A first-principles study 期刊论文
CHINESE PHYSICS B, 2017, 卷号: 26
作者:  Li, Wenbo;  Li, Ling;  Wang, Fangfang;  Zheng, Liu;  Xia, Jinghua
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Impact of Side Reservoir on Electromigration of Copper Interconnects 会议论文
2017 INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2017-01-01
作者:  Chen, Xiaoming;  Gao, Ge;  Geng, Baolin;  Li, Songsong
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect 期刊论文
Acta Metallurgica Sinica, 2017, 卷号: 53, 页码: 592-600
作者:  Huang ML(黄明亮)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Kuang, Jiameng;  Yang, Fan;  Huang, Mingliang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/03

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