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CORC

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基于HDP的汽车专利主题演化研究 期刊论文
情报学报, 2014, 卷号: 33, 页码: 944-951
作者:  王亮;  张绍武;  丁堃;  许侃;  林鸿飞
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Wang, Xiaohui;  Huang, Mingliang;  Yang, Fan;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
Study on Short Time Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pads 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Yang, Fan;  Huang, Mingliang;  Zhao, Ning
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Liu, Ting;  Huang, Mingliang;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stressing 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Pan, Song;  Huang, Mingliang;  Zhao, Ning;  Zhou, Shaoming;  Zhang, Zhijie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
Copper Filling Process for Small Diameter, High Aspect Ratio Through Silicon Via (TSV) 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Wei, Tiwei;  Cai, Jian;  Wang, Qian;  Liu, Ziyu;  Li, Yinan
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/13
Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Liu, Xiaoying;  Huang, Mingliang;  Zhao, Ning
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  Qu, L.;  Zhao, H. J.;  Wang, J.;  Gu, L. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13
Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  An, L. L.;  Qu, L.;  Wang, J.;  Gu, L. Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/13
The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  Wang, J.;  Qu, L.;  An, L. L.;  Gu, L. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13

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