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Abnormal migration behavior and segregation mechanism of Bi atoms undergoing liquid-solid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE, 2019, 卷号: 54, 页码: 7975-7986
作者:  Zhang, Z. J.;  Huang, M. L.
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Electromigration-induced -Sn grain rotation in lead-free flip chip solder bumps 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Kuang, Jiameng M.;  Sun, Hongyu Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
The 68th Electronic Components and Technology Conference
作者:  Huang ML(黄明亮);  Zou L(邹林);  Yin SQ(尹斯奇)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
68th IEEE Electronic Components and Technology Conference, ECTC 2018, San Diego, CA, United states, 2018-05-29
作者:  Huang, M.L.;  Zou, L.;  Yin, S.Q.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Impact of Side Reservoir on Electromigration of Copper Interconnects 会议论文
2017 INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2017-01-01
作者:  Chen, Xiaoming;  Gao, Ge;  Geng, Baolin;  Li, Songsong
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect 期刊论文
Acta Metallurgica Sinica, 2017, 卷号: 53, 页码: 592-600
作者:  Huang ML(黄明亮)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5 Cu flip chip solder interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/03
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03
Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Liu, XingBo;  Huang, Mingliang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03

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