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Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2017
Fang, Haoming; Bai, Shu-Lin; Wong, Ching Ping
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond 期刊论文
SMALL, 2017
Zhao, Songfang; Guo, Lingzhi; Li, Jinhui; Li, Ning; Zhang, Guoping; Gao, Yongju; Li, Jia; Cao, Duxia; Wang, Wei; Jin, Yufeng; Sun, Rong; Wong, Ching-Ping
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Investigations of silicon wafer bonding utilizing sputtered Al and Sn films 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017
Zhu, Zhiyuan; Yu, Min; Jin, Yufeng
收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03
DEVICES  MEMS  
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2016
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Initial thermal stress and strain effects on thermal mechanical stability of through silicon via 期刊论文
MICROELECTRONIC ENGINEERING, 2016
Sun, Yunna; Sun, Shi; Zhang, Yazhou; Luo, Jiangbo; Wang, Yan; Ding, Guifu; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
A full chip scale numerical simulation method for thermal management of 3D IC 其他
2016-01-01
Wang, Ningyu; Jin, Yufeng; Pi, Yudan; Wang, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他
2016-01-01
Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03

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