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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：清华大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 300mm晶圆化学机械抛光机关键技术研究与实现 期刊论文 2016, 2016 王同庆; 路新春; 赵德文; 门延武; 何永勇; WANG Tongqing; LU Xinchun; ZHAO Dewen; MEN Yanwu; HE Yongyong 收藏  |  浏览/下载：7/0 Performance of an integrated composite membrane electrode assembly in DMFC 期刊论文 2010, 2010 Wan, Nianfang; Mao, Zongqiang; Wang, Cheng; Wang, Gang 收藏  |  浏览/下载：1/0 High aspect ratio copper through-silicon-vias for 3D integration 期刊论文 2010, 2010 Chongshen Song; Zheyao Wang; Qianwen Chen; Jian Cai; Litian Liu 收藏  |  浏览/下载：2/0 High aspect ratio copper through-silicon-vias for 3D integration 会议论文 MICROELECTRONIC ENGINEERING, 12th European Workshop on Materials for Advanced Metallization, Dresden, GERMANY, Web of Science Song, Chongshen; Wang, Zheyao; Chen, Qianwen; Cai, Jian; Liu, Litian 收藏  |  浏览/下载：5/0 A 30 finger microwave power SiGe HBT with 23 V BV/sub CBO/ and f/sub T/ 7 GHz 期刊论文 2010, 2010 Xiong Xiaoyi; Zhang Wei; Xu Jun; Liu Zhihong; Chen Changchun; Huang Wentao; Li Xiyou; Zhong Tao; Qian Peixin 收藏  |  浏览/下载：1/0 Multi-layer thin films/substrate system subjected to non-uniform misfit strains 期刊论文 2010, 2010 Feng, X.; Huang, Y.; Rosakis, A. J. 收藏  |  浏览/下载：3/0