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CORC

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Electrical measurement and analysis of TSV/RDL for 3D integration 其他
2014-01-01
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17
Design guidelines for 3D RRAM cross-point architecture 其他
2014-01-01
Yu, Shimeng; Deng, Yexin; Gao, Bin; Huang, Peng; Chen, Bing; Liu, Xiaoyan; Kang, Jinfeng; Chen, Hong-Yu; Jiang, Zizhen; Wong, H.-S. Philip
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17
Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他
2014-01-01
Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Statistical Assessment Methodology for the Design and Optimization of Cross-Point RRAM Arrays 其他
2014-01-01
Li, Haitong; Jiang, Zizhen; Huang, Peng; Chen, Hong-Yu; Chen, Bing; Liu, Rui; Chen, Zhe; Zhang, Feifei; Liu, Lifeng; Gao, Bin; Liu, Xiaoyan; Yu, Shimeng; Wong, H.S. Philip; Kang, Jinfeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13
A comprehensive speed-power analysis of resistive switching memory arrays with selection devices 其他
2014-01-01
Li, Haitong; Huang, Peng; Chen, Zhe; Chen, Bing; Gao, Bin; Liu, Lifeng; Liu, Xiaoyan; Kang, Jinfeng
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13
A model predictive control method for bidirectional DC-DC converter in the ZVS condition 其他
2014-01-01
Li, Po; Huang, Di Bin; Zhang, Yi Ru; 李钷
收藏  |  浏览/下载：4/0  |  提交时间：2015/07/22
Electrical Interconnect in MEMS/NEMS Devices by Au/a-Si Eutectic Reaction 其他
2013-01-01
Huang, X.; Zhao, D. Q.; He, J.; Fan, X. J.; Yang, F.; Zhang, D. C.
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16
SILICON  WAFER  
Preliminary validation of entransy-based thermal management for 3D IC 其他
2013-01-01
Pi, Yudan; Sun, Han; Huang, Jie; Wang, Wei; Chen, Jing; Jin, Yufeng; Cao, Bingyang
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13
Realization of a modeling and simulation system for MID laser direct structuring equipment 其他
2013-01-01
Hu, Wen Juan; Zhuo, Yong; Wu, Xuan; Lan, Guo Wei; Zhao, Xin; 卓勇
收藏  |  浏览/下载：3/0  |  提交时间：2015/07/22
THE INVESTIGATION OF 3D EMBEDDED MICROCHANNEL NETWORKS FOR 3D IC COOLING, VACUUM PACKAGING AND THZ PASSIVE DEVICE APPLICATIONS 其他
2012-01-01
Miao, Min; Zhang, Jing; Zhang, Yang; Han, Bo; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16

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