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CORC

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LC Low-pass filter based on through-silicon via 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Huang, Jia;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
An Effective Method of Reducing TSV Thermal Stress by STI 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Qu, Xiaoqing;  Yu, Ningmei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20
A low-pass filter made up of the cylindrical through-silicon-via 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Fengjuan;  Huang, Jia;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong
收藏  |  浏览/下载：14/0  |  提交时间：2018/02/02
Combination of Electrical and Thermo-Mechanical Impacts of Through-Silicon Via (TSV) On Transistor 会议论文
International Conference on Electromagnetics in Advanced Applications, Verona, Italy
作者:  Yu NM(余宁梅);  Wang FJ(王凤娟);  Yang Y(杨媛);  Wang CL(王彩琳)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/20
Combination of Electrical and Thermo-Mechanical Impacts of Through-Silicon Via (TSV) On Transistor 会议论文
2017 INTERNATIONAL CONFERENCE ON ELECTROMAGNETICS IN ADVANCED APPLICATIONS (ICEAA), 2017-01-01
作者:  Yu, Ningmei;  Wang, Fengjuan;  Yang, Yuan;  Wang, Cailin
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15
Research on Crosstalk Issue of Through Silicon Via for 3D Integration 会议论文
2015 28TH IEEE INTERNATIONAL SYSTEM-ON-CHIP CONFERENCE (SOCC), 2015-01-01
作者:  Kang, Ting;  Yan, Zhaowen;  Zhang, Wei;  Wang, Jianwei
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/06
Research on the Transmission and Coupling Issue of Multilayer TSV and Multilayer TSV Array 会议论文
2015 IEEE 6TH INTERNATIONAL SYMPOSIUM ON MICROWAVE, ANTENNA, PROPAGATION, AND EMC TECHNOLOGIES (MAPE), 2015-01-01
作者:  Kang, Ting;  Yan, Zhaowen;  Zhang, Wei;  Wang, Jianwei
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06
Research on the Transmission and Coupling Issue of Multilayer TSV and Multilayer TSV Array 会议论文
6th IEEE International Symposium on Microwave, Antenna, Propagation, and EMC Technologies, Shanghai, PEOPLES R CHINA, 2015-10-28
作者:  Kang, Ting;  Yan, Zhaowen;  Zhang, Wei;  Wang, Jianwei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30

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