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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process 会议论文 作者:  Chen, H. J.;  Chen, D.;  Kuo, J. C.;  Pan, C. X.;  Liao, C. W. 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/05 Through hole (TH)  Electrolytic Cu  EBSD  Grain size  Orientation  Texture   Thermal conductivity studies of a GaN-sapphire structure by combined scanning thermal microscopy and electron backscatter diffraction(英文发表) 会议论文 张跃飞; 吉元 收藏  |  浏览/下载：5/0  |  提交时间：2017/06/16 The influence of pre-annealing on recrystallization in heavily cold-rolled nickel 会议论文 PROGRESSES IN FRACTURE AND STRENGTH OF MATERIALS AND STRUCTURES, 1-4, Asian Pacific Conference for Fracture and Strength (APCFS'06), Sanya, PEOPLES R CHINA, Web of Science Cheng, Zhan; Godfrey, Andrew; Zhang, Yubin; Liu, Wei; Liu, Qing 收藏  |  浏览/下载：3/0 Microtexture evolution via deformation twinning and slip during compression of magnesium alloy AZ31 会议论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 14th International Conference on the Strength of Materials (ICSMA 14), Xian, PEOPLES R CHINA, Web of Science Jiang, J.; Godfrey, A.; Liu, W.; Liu, Q. 收藏  |  浏览/下载：6/0