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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Application of interferometry measurement in large-scale optic-electrical theodolite (EI CONFERENCE) 会议论文 2012 International Conference on Sensors, Measurement and Intelligent Materials, ICSMIM 2012, December 26, 2012 - December 27, 2012, Guilin, China Zhao N.; Sun Z. 收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25 Interferometry is a very important method in high accuracy measurement for optical system. This article briefly introduced the conception of interferometry and took a product of 4D Technology as an example to carry on the measurement. A large-scale optic-electrical Theodolite in assemblage was measured  and its primary mirror was 400mm in diameter. With the analysis of the results  some micro adjustments of the mechanical structure proceed  and it made the system perform better. The final results of the whole system is 1.061 in P-V value and 0.1136 in RMS value (=632.8nm)  this meets the demand of optical design and practical application. The result demonstrates that interferometry is a good way to be utilized and optimize in the procedure of assemble. (2013) Trans Tech Publications  Switzerland.   Application of interferometry measurement in large-scale optic-electrical theodolite 会议论文 2012 International Conference on Sensors, Measurement and Intelligent Materials, ICSMIM 2012, December 26, 2012 - December 27, 2012, Guilin, China Zhao N.; Sun Z. 收藏  |  浏览/下载：8/0  |  提交时间：2014/05/15 Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China Ming A.; Liang J.; Lan W.; Dong W.; Yao J.; Wang W.; Le Z.; Chen W.; Wang L. 收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.