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半导体研究所 [9]
兰州理工大学 [8]
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会议论文 [42]
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Further Investigation on the Flow and Heat Transfer Mechanism of Single-Jet Film Cooling Based on Hybrid Thermal Lattice Boltzmann Method
会议论文
作者:
Shangguan, Yanqin
;
Wang, Xian
;
Zhang, Hu
;
Li, Yueming
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  |  
浏览/下载:10/0
  |  
提交时间:2019/11/19
film cooling
Hybrid thermal lattice Boltzmann method
mixing mechanism
multiple graphic processing units
multiple-relaxation-time collision model
Recent Advances in 2D Thermoelectric Materials
会议论文
Yu, Jiabing
;
Sun, Qiang
;
Jena, Puru
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  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
THERMAL-CONDUCTIVITY
1ST-PRINCIPLES CALCULATIONS
POWER-GENERATION
PENTA-GRAPHENE
HIGH FIGURE
CARBON
NANOSHEETS
MERIT
SHEET
PHOSPHORENE
Study of cooldown thermal loading effect on the bore deformation of viscoelastic solid propellant grain
会议论文
53rd AIAA/SAE/ASEE Joint Propulsion Conference, 2017, 2017-07-10
作者:
Adel, W.M.
;
Liang, G.-Z.
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  |  
浏览/下载:7/0
  |  
提交时间:2019/12/30
Composite propellants
Propellants
Propulsion
Rocket engines
Solid propellants
Strain
Stress relaxation
Testing
Viscoelasticity
Composite solid propellant
Environmental temperature changes
Experimental approaches
Low firing temperature
Nonlinear visco-elastic
Nonlinear viscoelastic material
Thermo-structural analysis
Time-temperature superposition principles
Finite element method
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill
会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02
作者:
Zeng, Q.
;
Guan, Y.
;
Su, F.
;
Chen, J.
;
Jin, Y.
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  |  
浏览/下载:7/0
  |  
提交时间:2019/12/30
Chip scale packages
Electronics packaging
Finite element method
Reliability
Thermal cycling
Viscoelasticity
Chip deformations
Relaxation modulus
Silicon interposers
Temperature dependent
Thermal-mechanical reliability
Time dependent
Viscoelastic properties
Williams-Landel-Ferry equations
Three dimensional integrated circuits
Influence of annealing treatment on microstructure and mechanical properties of Fe-Cu-Si-Al amorphous composites
会议论文
Guiyang, China, July 10, 2015 - July 14, 2015
作者:
Zhao, Yanchun
;
Ma, Wenlong
;
Yuan, Xiaopeng
;
Zhao, Zhi Ping
;
Huang, Mingyuan
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  |  
浏览/下载:1/0
  |  
提交时间:2020/11/15
Amorphous alloys
Annealing
Copper alloys
Iron alloys
Mechanical properties
Melting
Microstructure
Silicon alloys
Temperature
Thermodynamic stability
Amorphous composite
Annealing treatments
Bulk amorphous alloys
Compressive properties
Inter-atomic distances
Microstructure and mechanical properties
Residual thermal stress
Solidified microstructures
Mechanism of internal modification in bulk borosilicate glass with picosecond laser pulses at high repetition rates
会议论文
4th pacific rim laser damage symposium on optical materials for high-power lasers
作者:
Sun, Mingying
;
Eppelt, Urs
;
Schulz, Wolfgang
;
Zhu, Jianqiang
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  |  
浏览/下载:17/0
  |  
提交时间:2016/11/28
New Results on Contact Binary Stars
会议论文
Sejong University Convention Center, Seoul, Korea, 2013-05-27
作者:
He JJ(何家佳)
;
Qian SB(钱声帮)
;
Zhu LY(朱俐颖)
;
Liu L(刘亮)
;
Liao WP(廖文萍)
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  |  
浏览/下载:16/0
  |  
提交时间:2016/10/09
A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel
会议论文
Montréal, Quebec, Canada, 2014-6-22
Shouwei Hu
;
Yi Chen
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  |  
浏览/下载:26/0
  |  
提交时间:2015/03/12
material modeling
multiphysics FEM
epoxy adhesive
cure shrinkage
viscoelastic effect
residual stresses
The thermal relaxation effect on damage of current filament for high power Gallium Arsenide photoconductive switch
会议论文
osa topical conference:the 4th advances in optoelectronics and micro/nano-optics, xi’an, china, 2014-09
作者:
Ma xiangrong
;
Shi Wei
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  |  
浏览/下载:12/0
  |  
提交时间:2015/05/22
Experimental study on the vascular thermal response to visible laser pulses
会议论文
作者:
Li, D.
;
Chen, B.
;
Wu, W.J.
;
Wang, G.X.
;
He, Y.L.
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  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Clinical practices
Congenital vascular malformation
Dorsal skin chamber
Electron transport
Microscopic measurement
Optimal pulse duration
Thermal relaxation time
Thermal response
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