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CORC

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Design Study of an Electron Storage Ring for the Future Plan of Hiroshima Synchrotron Radiation Center. 会议论文
Australia, 2019
作者:  S. Matsuba;  M. Katoh;  K.S. Shimada
收藏  |  浏览/下载：14/0  |  提交时间：2019/08/06
Study on Cooling Technology of the Superconducting Undulator at SSRF 会议论文
Paris, 2018
作者:  S.H. Wang;  J. Wang;  S. Sun;  Y. Liu;  L. Wang
收藏  |  浏览/下载：12/0  |  提交时间：2019/03/13
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stage 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Ma, Haitao
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Dong, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09
Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Zhao, Ning
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/09
In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
USING A LIENARD-WIECHERT SOLVER TO STUDY COHERENT SYNCHROTRON RADIATION EFFECTS 会议论文
Proceedings of FEL2013, New York, NY, USA, New York, 2013
作者:  R.D. Ryne;  C.E. Mitchell;  J. Qiang
收藏  |  浏览/下载：9/0  |  提交时间：2017/02/16
Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/11
In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Ma, H. T.;  Qu, L.;  Zhao, H. J.;  Wang, J.;  Gu, L. Y.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13

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